{"id":30132,"date":"2022-09-07T10:05:55","date_gmt":"2022-09-07T05:05:55","guid":{"rendered":"https:\/\/pr.asianetpakistan.com\/?p=97618"},"modified":"2022-09-07T10:05:55","modified_gmt":"2022-09-07T05:05:55","slug":"atlas-magnetics-co-announces-new-thin-film-magnetic-material","status":"publish","type":"post","link":"https:\/\/myanmarnewsgazette.com\/atlas-magnetics-co-announces-new-thin-film-magnetic-material\/","title":{"rendered":"Atlas Magnetics, Co. announces new\u00a0thin-film magnetic material\u00a0"},"content":{"rendered":"
Highly layered magnetic material is compatible\u00a0with semiconductor packaging\u00a0<\/em><\/strong><\/p>\n RENO, Nev., Sept. 06, 2022 (GLOBE NEWSWIRE) — Atlas Magnetics, Co<\/u><\/a>., \u201cAM,\u201d is a Nevada-based\u00a0fabless semiconductor company focused on advance material deposition on\u00a0standard semiconductor packaging film to create unique IC solutions. AM\u00a0announces a high-performance magnetic material to reduce the size of the\u00a0magnetic components used in consumer and IoT electronic circuits\u00a0effectively removing the inductor from the PCB in applications such as\u00a0DC\/DC power conversion.<\/p>\n AM solves the problem of direct integration of magnetics into integrated\u00a0circuits \u201cchips\u201d by electroplating highly layered magnetic alloys directly on\u00a0semiconductor epoxy packaging films for short connection to the\u00a0semiconductor die using standard IC bumping processes.<\/p>\n This long-desired concept of using available semiconductor manufacturing\u00a0processes to remove discrete components, such as inductors and\u00a0transformers, was previously hindered by cost, frequency response, and\u00a0incompatible processes. However, this development resolves these barriers\u00a0while delivering the promised size reductions and performance\u00a0enhancements by magnetic material deposition at temperatures and\u00a0pressures compatible with semiconductor packaging.<\/p>\n \u201cWhile layering magnetic materials to create high frequency, high efficiency\u00a0cores is nothing new, what\u2019s new is how to cost effectively create micron to\u00a0sub-micron layering. This is accomplished by reducing the process steps per\u00a0layer from 13 to just 4. This simplified process allows new magnetic materials\u00a0to be engineered for frequency (60 MHz or greater) and Qs (up to 35) with\u00a0layering up to 60+ layers,\u201d stated Atlas Magnetics CEO, John McDonald.\u00a0\u201cWhen these 0.2 to 0.4 mm cores are used in a finished inductor or\u00a0transformer, values of up to 1 \u03bcH for lower power applications, and for high-power reduced inductance applications current densities of up to 10A\/mm2\u00a0can be achieved.<\/p>\n In fact, the layering can be so fine as to yield materials with unique\u00a0mechanical and electrical parameters. This opens new avenues of research\u00a0for novel materials not previously economically feasible.\u201d<\/p>\n